1 / 4 www.asb.co.kr februa ry 2010 p lerow tm ALN1101R2 internally matched lna module the plerow tm aln - series is the compactly designed surface - mount module for the use of the lna w ith or without the following gain blocks in the infrastructure equipment of the mobile wireless (cdma, gsm, pcs, phs, wcdma, dmb, wlan, wibro, wimax), gps, satellite commun i- cation terminals , catv and so on. it has an exceptional performance of low noise fi gure, high gain, high oip3, and low bias current. the stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application system environment. the surface - mount module pac kage including the completed matching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass production level. parameter unit specifications min typ max frequency range mhz 950 1250 gain db 32 33 gain flatness db 0.9 1.1 noise figure db 0.75 0.8 output ip3 (1) dbm 34 35 s11/s22 (2) db - 18/ - 12 output p1db dbm 20 21 swi tching time (3) m sec - supply current ma 110 130 supply voltage v 5 impedance w 50 max. rf input power dbm c.w 23~25 (before fail) package type & size mm surface mount type, 10wx10lx3.8h operating temperature is C 40 c to +85 c. 1) oip3 is measured wi th two tones at an output power of 4 dbm/tone separated by 1 mhz. 2) s11, s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage f rom 0 v to v s . pin number function 2 rf in 4 v s 6 rf out other s ground ou t line drawing (unit: mm) note: 1. the number and size of ground via holes in a circuit board is critical for thermal rf grounding consider a tions. 2. we recommend that the ground via holes be placed on the bottom of all ground pins for better rf and thermal performance, as shown in the dra w ing at the left side. (recommended footprint) ALN1101R2 asb inc. (top view) (bottom view) ? 0.4 plated thru holes to ground plane plerow (side view) solder stencil area website: www.asb.co.kr e - ma il: sales@asb.co.kr tel: (82) 42 - 528 - 722 3 f ax : (82) 42 - 528 - 7222 more inform a tion 2 - stage single type s 21 = 33.9 db@950 mhz = 32.1 db@1 250 mhz nf of 0.75 db over freque n cy unconditionally stable single 5 v supply high oip3@low current feature s description specifications (in pr o duction) typ.@t = 25 c, v s = 5 v, freq. = 1100 mhz, z o.sys = 50 ohms
2 / 4 www.asb.co.kr februa ry 2010 p lerow tm ALN1101R2 internally matched lna module s - param e ters noise figure oip3 p1db 950~1250 mhz +5 v typical performance (measured) s - parameters & k fa c tor
3 / 4 www.asb.co.kr februa ry 2010 p lerow tm ALN1101R2 internally matched lna module 1) the tantal or mlc (multi layer ceramic) capacitor is optional and for bypassing the ac noise introduced from the dc supply. the capacitance value may be determined by customer s dc supply status . the c a- pacitor should be placed as close as possible to v s pin and be connected directly to the ground plane for the best electrical performa nce . 2) dc blocking capacitors are always necessarily placed at the input and output port for allowing only the rf signal to pass and blocking the dc component in the signal. the dc blocking capacitors are i n clu d- ed inside the aln module. therefore, c1 & c2 ca pacitors may not be necessary, but can be added just in case that the customer wants. the value of c1 & c2 is determined by considering the application fr e- quency. application circuit recommended soldering reflow process 20~40 sec 260 c 200 c 150 c 60~180 sec ramp - up (3 c/sec) ramp - down (6 c/sec) + - aln out in c1 c2 v s tantal or mlc (multi layer c e ramic) c a pacitor size 25x25 mm (for aln - r series C 10x10 mm) evaluation board layout in out vs
4 / 4 www.asb.co.kr februa ry 2010 p lerow tm ALN1101R2 internally matched lna module
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